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NewsSSESSMENTS: Amkor Technology and TSMC Supply US Semiconductor Sector With Advanced Packaging

Author: SSESSMENTS

Amkor Technology and TSMC have signed a memorandum of understanding to bring advanced packaging and test capabilities to Arizona to expand the US’ semiconductor ecosystem.  TSMC is contracting turnkey advanced ...

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Tags: All Plastics,All Products,Americas,English,News,US

Published on October 9, 2024 12:45 PM (GMT+8)
Last Updated on October 9, 2024 12:45 PM (GMT+8)