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NewsSSESSMENTS: SK Hynix to Build Advanced Packaging Plant in Indiana for $3.9 Bn

Author: SSESSMENTS

This would be the S.Korean chipmaker’s first chip plant in the US, also the industry’s first advanced packaging plant there SK Hynix Inc., the world’s leading high bandwidth memory (HBM) ...

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Tags: All Chemicals,All Products,Asia Pacific,English,Korea,NEA,News

Published on April 8, 2024 2:12 PM (GMT+8)
Last Updated on April 8, 2024 2:12 PM (GMT+8)